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C-0367 Single-Component Low-Temperature Thermosetting Epoxy Adhesive

Brief Introduction:

Epoxy adhesive series features high strength, excellent chemical corrosion resistance and good insulation. It is suitable for electronic and electrical encapsulation, structural bonding and other fields, providing reliable protection and fixation for electronic components. It also performs well in building reinforcement and craft bonding; its excellent bonding performance ensures the stability of building structures and crafts.
  • Product Introduction
Product Performance
One-component low-temperature thermosetting epoxy adhesive: The low-temperature range refers to 60–80°C. It features high strength, chemical resistance, and excellent insulation. Suitable for electronic and electrical packaging, structural bonding, and other applications, it provides reliable protection and fixation for electronic components. It also performs well in building reinforcement and handicraft bonding, where its excellent bonding performance ensures the stability of building structures and handicrafts.
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